发明名称 |
PLANAR PACKAGELESS SEMICONDUCTOR STRUCTURE WITH VIA AND COPLANAR CONTACTS |
摘要 |
A semiconductor device includes a substrate having a first side and a second side and an epitaxial layer disposed over the second side. The device also includes a conductive via extending through the epitaxial layer to the second side and comprising a conductive contact; and a bond pad disposed over the epitaxial layer and comprising a conductive material, wherein the semiconductor is not provided in a package.
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申请公布号 |
US2009273093(A1) |
申请公布日期 |
2009.11.05 |
申请号 |
US20080112652 |
申请日期 |
2008.04.30 |
申请人 |
AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD. |
发明人 |
LYPEN WILLIAM J.;SNYDER RICK D. |
分类号 |
H01L23/485 |
主分类号 |
H01L23/485 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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