| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing wiring boards which is high in production efficiency and small in waste of materials since no adhesive needs to be used. Ž<P>SOLUTION: The method of manufacturing wiring boards includes: a thermal fusion process of stacking metal plates 53 each having a protection film 53a bonded on one surface, or stacks of metal plates 53 together in one body by thermally fusing protection films 53a; a wiring layer forming process of forming a wiring layer on both surface sides of the obtained stack at the same time; and a dividing process of dividing the stack having formed the wiring layers into both sides to obtain the wiring boards. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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