| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board in which the suitable wiring board is obtained while production efficiency is improved and curvature that is highly likely to be generated on the wiring board during continuous production is suppressed. SOLUTION: The method of manufacturing the wiring board includes: a continuous process of forming at least an insulating layer on a long-sized metal foil to continuously obtain a primary laminate; a bonding process of obtaining a secondary laminate in such a way that a pair of the primary laminates are bonded in a state the primary laminates are in opposite vertical directions; a wiring layer forming process of obtaining a tertiary laminate having at least wiring layers on both surface sides of the secondary laminate; and a dividing process of obtaining wiring boards by dividing the tertiary laminate. COPYRIGHT: (C)2010,JPO&INPIT
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