| 摘要 |
A solder ball for semiconductor device package is provided to prevent the oxidation blocking and blackening by coating antistatic agent, coupling agent, rosin on the solder ball surface. The solder ball for semiconductor package comprises the coating layer which dissolves the antistatic agent, and the rosin or the coupling agent on the solder ball surface. The antistatic agent is one among wax, loop aliphatic amine, amide, impression ester and polyethylene glycol esther, etc. The coupling agent is silicon or Ti group. The rosin is one among gum rosin, polymerized rosin, and ester denaturation and hydrogenated rosin. The solvent is one among alcoholometer solvent, and hydrocarbon-based solvent and ketone-based solvent. |
