| 摘要 |
PROBLEM TO BE SOLVED: To provide a film forming device that imparts stress larger than stress, imparted under process conditions, to a thin film. SOLUTION: The film forming device includes a processing container 1, a substrate mounting table 3 provided in the processing container 1 and on which a substrate W to be processed is mounted, and a film forming material supply means 27 of supplying a film forming material into the processing container 1, and a spherical hollow 3b or spherical swell is formed on a substrate mounting surface 3a of the substrate mounting table 3 where the substrate W to be processed is mounted. COPYRIGHT: (C)2010,JPO&INPIT |
