| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a Cu-Ni-Si-Co-based alloy for an electronic material having excellent spring critical value and stress relaxation properties in addition to strength and conductivity. Ž<P>SOLUTION: Disclosed is a copper alloy for an electronic material comprising, by mass, 1.0 to 2.5% Ni, 0.5 to 2.5% Co and 0.3 to 1.2% Si, and the balance Cu with inevitable impurities, and in which, among the secondary phase grains precipitated into the mother phase, the quantitative density of the ones with grain sizes of 0.1 to 1 μm is 5×10<SP>5</SP>to 1×10<SP>7</SP>pieces/mm<SP>2</SP>. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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