WAFER LEVEL PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A wafer level package and method for manufacturing the same are provided to form the telecommunication line of the package internal unit without the separate via process of passing through a substrate. CONSTITUTION: The wafer level package includes the first substrate(220), the input-output pad(222), the second substrate(210), and the solder. The first substrate includes the common duct in which the first internal units are positioned. The input-output pad is formed in the first top of the substrates. The input-output pad is electrically connected to the first internal units. The second substrate is positioned on the first substrate. The second substrate corresponds to the input-output pad is removed. The solder joins the first substrate and the second substrate.