发明名称 Semiconductor device having strain-inducing substrate and fabrication methods thereof
摘要 A semiconductor device includes a semiconductor substrate that includes a substrate layer having a first composition of semiconductor material. A source region, drain region, and a channel region are formed in the substrate, with the drain region spaced apart from the source region and the gate region abutting the channel region. The channel region includes a channel layer having a second composition of semiconductor material. Additionally, the substrate layer abuts the channel layer and applies a stress to the channel region along a boundary between the substrate layer and the channel layer.
申请公布号 US7605031(B1) 申请公布日期 2009.10.20
申请号 US20080178291 申请日期 2008.07.23
申请人 DSM SOLUTIONS, INC. 发明人 KAPOOR ASHOK K.
分类号 H01L21/337 主分类号 H01L21/337
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