| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide: a semiconductor device mounting substrate high in joint reliability and capable of solving a problem wherein, in a mounting structure between a BGA/LGA type semiconductor device and a printed wiring board, fatigue breakdown of a solder joint part associated with temperature variation such as cooling during operation and after operation stop occurs, and, in a BGA/LGA mounting structure applied to a portable apparatus, a load associated with board deformation caused by drop or key pressing is imposed on a solder joint part; a method of manufacturing the same; and a semiconductor module. <P>SOLUTION: By the semiconductor device mounting substrate 10 structured to include at least flat elastic pads 1 each having a jointing electrode 2 at the center part, and a wiring base material 4 supporting peripheries of the elastic pads 1 and having elastic deformation regions 5 of the elastic pads 1 on the backsides of the elastic pads 1, stress generated in a connection part between the semiconductor device and the printed wiring board can be relaxed, and joint reliability can be improved by having rigidity. The elastic pad 1 preferably has concentric circular irregularity or an accordion structure, and preferably comprises an integrated circular disk. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
