PROCESS FOR PREPARING A POLYMERIC RELIEF STRUCTURE

摘要

The invention relates to a photo-embossing process for the preparation of a polymeric relief structure comprising the steps of: a) coating a substrate with a coating composition comprising one or more radiation-sensitive ingredients and less than 30 wt% polymeric binder material; b) locally treating the coated substrate with electromagnetic radiation having a periodic, non-periodic or random radiation-intensity pattern, forming a latent image, at a temperature below a transition temperature of the coating composition; and c) polymerizing and/or crosslinking the resulting coated substrate, at a temperature above said transition temperature, wherein the transition temperature is a temperature that defines a transition of the coating composition between a state of high viscosity and low viscosity and wherein the coating composition comprises a compound A comprising at least one radiation curable group and a photoinitiator, the coating composition having a transition temperature between 30°C and 120°C.