发明名称 Thermosetting Resin Composition and Semiconductor Sealing Medium
摘要 A thermosetting resin compositing having an essential component (A) organopolysiloxane containing a compound represented by following general formula (1) or (2) and optical semiconductor peripheral material using the composition. [Herein, in the formulas, R1 independently represents a substituted or non-substituted monovalent hydrocarbon radical with the carbon number of 1 to 10, R2 represents an epoxy group-containing organic group, R3 represents R1 or R2, a independently represents an integer of 2 or more, b independently represents an integer of 0 or more, X represents general formula (3) , Y represents a bivalent hydrocarbon radical with the carbon number of 1 to 6, Z represents following formula (4), R1 in the formula independently represents a substituted or non-substituted monovalent hydrocarbon radical with the carbon number of 1 to 10, and c represents an integer of 0 or more.]
申请公布号 US2009258992(A1) 申请公布日期 2009.10.15
申请号 US20060083864 申请日期 2006.10.18
申请人 发明人 YAMAMOTO HISANAO;MATSUDA TAKAYUKI;TAKAHASHI HIDEAKI
分类号 C08L83/04;C08G59/32;C08G77/14;C08G77/50;H01L21/52;H01L23/29;H01L23/31;H01L33/48 主分类号 C08L83/04
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