| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the bonding strength between a conductor pattern layer and a base body and to reduce the influence of gas produced in a via hole. Ž<P>SOLUTION: The substrate includes the base body, a via conductor 12, and a first plating layer 14. The substrate further includes the conductor pattern layer 17. The base body contains a ceramic material, and has a surface provided with a via hole. The via conductor 12 is disposed within the via hole. The first plating layer 14 is formed on the via conductor 12. The conductor pattern layer 17 contains an active metal. The conductor pattern layer 17 is partially arranged on the first plating layer 14, and formed on a surface of the base body. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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