DICING TAPE, DICING TAPE INTEGRATED TYPE ADHESIVE SHEET, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a dicing tape can cut an adhesive sheet along with a semiconductor wafer at the same time in cutting conditions of the adhesive sheet and the semiconductor wafer normally executed; a dicing tape integration type adhesive sheet; and a manufacturing method of a semiconductor device using them. SOLUTION: This dicing tape is used for this manufacturing method of a semiconductor device including a process (IV) of providing a plurality of segmented semiconductor chips with adhesive tapes by cutting the adhesive tapes, and characterized in that a yield point is not shown in tensile deformation of the dicing tape, and adhesive force between the dicing tape and the adhesive sheet is 20-100 N/m in the process (IV). COPYRIGHT: (C)2010,JPO&INPIT