| 摘要 |
PROBLEM TO BE SOLVED: To perform mounting of electronic parts efficiently when a receiving pressure in a step of a mounting tool receiving semiconductor chips from a wafer stage and a mounting pressure in a step of mounting are varied. SOLUTION: The device for mounting electronic parts is provided with a means 27 for applying a pressure adapted to selectively applying a receiving pressure and a mounting pressure, in which the receiving pressure is applied to a semiconductor chip when a mounting tool 17 receives the semiconductor chip from a wafer stage and the mounting pressure is applied when mounting is made on a substrate. The means for applying a pressure has: a cylinder 12 including a driving shaft 16 that is driven by a fluid pressure and to which the mounting tool is fixed; a first electro-pneumatic regulator 33 for setting a fluid to a pressure corresponding to the receiving pressure to supply the fluid to the cylinder; a second electro-pneumatic regulator 35 for setting a fluid to a pressure corresponding to the mounting pressure to supply the fluid to the cylinder; and a first and a second changeover valves 34, 36 for selectively supplying, to the cylinder, the fluid having a pressure respectively controlled by the first and the second electro-pneumatic regulator. COPYRIGHT: (C)2010,JPO&INPIT |
