| 发明名称 |
INTERPOSERS, ELECTRONIC MODULES, AND METHODS FOR FORMING THE SAME |
| 摘要 |
Electronic modules and interposers are formed by encapsulating microelectronic dies and/or posts within cavities in a substrate.
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| 申请公布号 |
US2009250249(A1) |
申请公布日期 |
2009.10.08 |
| 申请号 |
US20090407252 |
申请日期 |
2009.03.19 |
| 申请人 |
|
发明人 |
RACZ LIVIA M.;TEPOLT GARY B.;THOMPSON JEFFREY C.;LANGDO THOMAS A.;MUELLER ANDREW J. |
| 分类号 |
H05K1/11;H05K1/00;H05K1/16;H05K3/00 |
主分类号 |
H05K1/11 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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