| 摘要 |
Affords a compound semiconductor substrate packaging method for preventing oxidation of the surface of compound semiconductor substrates. The compound semiconductor substrate packaging method provides: a first step of inserting a compound semiconductor substrate (10) into a gas-permeable, rigid container (20), placing the rigid container (20) into an inner-packing pouch (30) having an oxygen transmission rate of 1 to 100 ml.m-2.day-1.atm-1, and a moisture transmission rate of 1 to 15 g.m-2 day-1, replacing the air inside the inner-packing pouch (30) with an inert gas, and hermetically sealing the inner-packing pouch; and a second step of placing the sealed inner-packing pouch (30), and a deoxygenating/dehydrating agent (40) that at least either absorbs or adsorbs oxygen gas and moisture, into an outer-packing pouch (60) that has an oxygen transmission rate that is 5 ml.m-2.day-1.atm-1 or less and is lower than that of the inner-packing pouch (30), and a moisture transmission rate that is 3 g m-2.day-1 or less and is lower than that of the inner-packing pouch (30), and hermetically sealing the outer-packing pouch (60).
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