发明名称 |
CIRCUIT BOARD HAVING BUILT-IN ELECTRONIC PARTS AND ITS MANUFACTURING METHOD |
摘要 |
<p>A connection terminal (80) for mounting an electronic part (2) is formed on a first substrate on which a copper foil is arranged in such a manner that it cannot be separated from a carrier. The connection terminal (80) is electrically connected to a bump (20) of the electronic part (2). An underfilling material (4) is arranged between the electronic part (2) and the first substrate. The electronic part (2) is covered by an insulation material (3). The carrier is separated from the copper foil and the exposed unnecessary copper foil is removed by etching so as to obtain a circuit board having built-in electronic parts (1).</p> |
申请公布号 |
WO2009118925(A1) |
申请公布日期 |
2009.10.01 |
申请号 |
WO2008JP65219 |
申请日期 |
2008.08.26 |
申请人 |
IBIDEN CO., LTD. |
发明人 |
FURUTANI, TOSHIKI;FURUSAWA, TAKESHI;KARIYA, TAKASHI;TANIGUCHI, HIROTAKA |
分类号 |
H05K3/46;H01L23/12 |
主分类号 |
H05K3/46 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|