APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENT

摘要

An electronic component mounting apparatus is provided with a substrate supply stocker (2) arranged on one end side of a guide rail (1) and a collecting stocker (26) arranged on the other end side; a supply chuck (7) which supplies a plurality of substrates from the supply stocker to a supply position (S) on the one end side of the guide rail; a mounting stage (9) which is arranged to be driven to reciprocate between the supply position (S) and a mounting position (B), and receives the substrates at the supply position (S) from the guide rail and transfers the substrates to the mounting position; a plurality of mounting tools (17) which mount electronic components at the same time onto the substrates transferred from the supply position (S) to the mounting position (B); and a plurality of carry-out chucks (21, 22), which transfer the substrates whereupon the electronic components are mounted to an ejecting position (E) and store the substrates in the collecting stocker, while the mounting stage is transferring, at the mounting position, the substrates whereupon the electronic components are mounted to the guide rail, returning to the supply position and transferring new substrates to the mounting position.