发明名称 |
ROBUST MULTI-LAYER WIRING ELEMENTS AND ASSEMBLIES WITH EMBEDDED MICROELECTRONIC ELEMENTS |
摘要 |
An interconnect element (130) can include a dielectric layer (116) having a top face (116b) and a bottom face (116a) remote from the top face, a first metal layer defining a plane extending along the bottom face and a second metal layer extending along the top face. One of the first or second metal layers, or both, can include a plurality of conductive traces (132, 134). A plurality of conductive protrusions (112) can extend upwardly from the plane defined by the first metal layer (102) through the dielectric layer (116). The conductive protrusions (112) can have top surfaces (126) at a first height (115) above the first metal layer (132) which may be more than 50% of a height of the dielectric layer. A plurality of conductive vias (128) can extend from the top surfaces (126) of the protrusions (112) to connect the protrusions (112) with the second metal layer. |
申请公布号 |
WO2009048604(A3) |
申请公布日期 |
2009.09.24 |
申请号 |
WO2008US11632 |
申请日期 |
2008.10.08 |
申请人 |
TESSERA, INC.;HABA, BELGACEM;OGANESIAN, VAGE;ENDO, KIMITAKA |
发明人 |
HABA, BELGACEM;OGANESIAN, VAGE;ENDO, KIMITAKA |
分类号 |
H05K3/46;H01L23/12;H01L23/48 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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