| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing device that excellently remove pure water from the surface of a substrate without wasting a low-surface-tension liquid, such an IPA liquid, nor time, and to provide a substrate processing method. SOLUTION: Pure water is supplied by a pure water nozzle 3 to the surface of a wafer W held by a spin chuck 2. The IPA liquid having lower surface tension than the pure water is supplied by an IPA nozzle 4 to the surface of the wafer W held by the spin chuck 2. When the IPA liquid is supplied, a measuring device 5 detects water concentration in the liquid on the surface of the wafer. On the basis of the water concentration, a control unit 21 decides whether the supply of the IPA liquid is to be ended. COPYRIGHT: (C)2009,JPO&INPIT
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