| 摘要 |
An electronic device having a heat-dissipating mechanism includes a housing and a cooling device. The housing is provided with an intake hole and a plurality of exhausting holes. The interior of the housing is provided with a heat-dissipating fan. The cooling device includes a cooling chip, at least one cooler and at least one heater. The cooling chip has a cold end and a hot end opposite to each other. The cooler is connected to the cold end of the cooling chip. The cooler is arranged at one side of the heat-dissipating fan in the direction of airflow generated by the heat-dissipating fan. The heater is connected to the hot end of the cooling chip. The heater is located outside the housing and corresponds to the locations of the exhausting holes. Via this arrangement, the temperature within the housing of the electronic device can be reduced efficiently.
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