SUBSTRATE FOR MOUNTING ELECTRONIC COMPONENT, AND MOUNTING STRUCTURE FOR ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a substrate for mounting an electronic component that improves reliability of connection with a connection electrode. SOLUTION: The substrate for mounting the electronic component has the electronic component 1 having electrodes 12 and 13 formed mounted on a function piece 11. The substrate has a bump electrode 14 which comes into electric contact with the electrodes. The bump electrode has an elastic core portion 24 and conductive films 25 and 26 which are provided on an upper surface of the core portion and come into electric contact with the electrodes through elastic deformation of the core portion. COPYRIGHT: (C)2009,JPO&INPIT