BUILT-IN METHOD OF THERMAL DISSIPATION LAYER FOR DRIVER IC SUBSTRATE, AND STRUCTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To improve heat dissipation by providing a method and a structure for having a heat dissipation layer built-in in a driving IC board.

SOLUTION: A COF (chip on film) structure includes a flexible circuit board and a chip. The flexible circuit board includes a flexible base film and a conductive layer. The flexible base film has a polyimide layer and an anisotropic conductive layer (ACL). The conductive layer is disposed on the flexible base film. The conductive layer and the ACL are separated by the polyimide layer. The chip is mounted to the conductive layer through interconnectors.

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