| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer insulating film, in which voids hardly develop within a board upon lamination of a multilayer insulating film on a circuit board, surface flatness is fully ensured and the thickness of the first layer of the multilayer insulating film can be kept uniform and the first layer and the second layer hardly separate from each other. <P>SOLUTION: In the manufacturing method of the multilayer insulating film equipped with a base material and an insulating layer comprising the first layer contacting with the base material and the second layer, the insulating layer is formed through a first process for producing a first layer made of a cured film formed in a filmy and cured resin composition (I) including a thermosetting resin, a hardener, an inorganic filler and a polymeric material including 5-60 wt.% of a resin having a weight average molecular weight of≥5,000 and, in succession, a second process for laminating onto the cured film a second layer made of a resin composition (II) including the thermosetting resin, the hardener and 30-90 wt.% of the inorganic filler. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
