| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that a conventional wafer container is incapable of reducing a warpage of a large-diameter wafer of≥300 mm in diameter and a thin wafer of≤0.3 mm in thickness to the minimum to efficiently contain a number of wafers. SOLUTION: The wafer storage container includes a container body having at least one container opening, and a wafer supporting structure formed in the container body. The wafer supporting structure has a fixing portion fitted and fixed to the container body, and a pair of wafer supports connected to the fixing portion to be able to open/close freely. The pair of wafer supports has slit openings arranged oppositely with space therebetween. The fixing portion has a fixing portion side fitting portion. The interior surface of the storage container body is provided with a storage container side fitting portion. COPYRIGHT: (C)2009,JPO&INPIT |
