发明名称 Method for manufacturing wiring substrate
摘要 A method for manufacturing a wiring substrate includes the steps of: (a) patterning a surface-active agent on a substrate having first and second areas to be remained on the first area; (b) removing residues of the surface-active agent in the second area by wet-etching with an alkali; (c) patterning a catalyst to be remained on one of the second area of the substrate and the surface-active agent; and (d) depositing a metal layer on the catalyst to thereby form a wiring.
申请公布号 US7585540(B2) 申请公布日期 2009.09.08
申请号 US20050091919 申请日期 2005.03.28
申请人 SEIKO EPSON CORPORATION 发明人 FURIATA HIDEMICHI;KIMURA SATOSHI;MARUMO MINORU
分类号 B05D5/12;B05D3/12;C23C18/16;C23C18/28;C23F1/00;H01B13/00;H01L23/12;H05K3/18 主分类号 B05D5/12
代理机构 代理人
主权项
地址