发明名称 |
Method for manufacturing wiring substrate |
摘要 |
A method for manufacturing a wiring substrate includes the steps of: (a) patterning a surface-active agent on a substrate having first and second areas to be remained on the first area; (b) removing residues of the surface-active agent in the second area by wet-etching with an alkali; (c) patterning a catalyst to be remained on one of the second area of the substrate and the surface-active agent; and (d) depositing a metal layer on the catalyst to thereby form a wiring.
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申请公布号 |
US7585540(B2) |
申请公布日期 |
2009.09.08 |
申请号 |
US20050091919 |
申请日期 |
2005.03.28 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
FURIATA HIDEMICHI;KIMURA SATOSHI;MARUMO MINORU |
分类号 |
B05D5/12;B05D3/12;C23C18/16;C23C18/28;C23F1/00;H01B13/00;H01L23/12;H05K3/18 |
主分类号 |
B05D5/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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