发明名称 THERMALLY OPERATED OVERLOAD RELAY
摘要 PROBLEM TO BE SOLVED: To improve a linking structure of an adjustment dial and a release lever so that reliability is enhanced, by suppressing the effect of deformation of an outer case due to thermal expansion or swelling on operating characteristics, and so that reduction in the number of parts and space saving of the outer case are realized. SOLUTION: In the thermal overload relay in which a linking assembly of a main bimetal 2, curved by receiving energizing heating of a main circuit current, a shifter 3 which is driven-shifted to curving of the main bimetal, a release lever 5 made to be confronted with a reverse spring 7 for driving of a contact switching mechanism 6 by being linked to the shifter, and an adjustment dial 11 to position the release lever according to setting of a setting current value is internally installed in the outer case 1, and in which the switching operation of the output contact is made to be carried out by acquiring the curving of the main bimetal 2 due to energization of overcurrent, the release lever 5 is directly link-connected and integrated to the adjustment dial 11 consisting of a slider 14 and a stationary spring 15; and the release lever 5 is positioned, in matching with the setting of the setting current value by the operation of the slider 14. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009193785(A) 申请公布日期 2009.08.27
申请号 JP20080032184 申请日期 2008.02.13
申请人 FUJI ELECTRIC FA COMPONENTS & SYSTEMS CO LTD 发明人 TATSUKAWA MASAHIRO;NAKANO MASAYOSHI;FURUHATA YUKIO
分类号 H01H61/00 主分类号 H01H61/00
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