| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To obtain a method for manufacturing a multilayer interconnection board for facilitating fine wiring while improving connection reliability between a via and a via hole. <P>SOLUTION: A via land 2b is formed on a core substrate 1, and a resin film 9 removable by a chemical liquid is formed on the via land 2b. A resin layer 10 is formed on the core substrate 1 where the resin film 9 is formed, and a via hole 11 through the resin layer 10 is formed to expose the resin film 9. Then, the resin film 9 is dissolved by a chemical liquid and is removed, the bottom area of the via hole 11 is expanded and an expansion section 11a is formed, a conductive paste 12 is filled into the via hole 11 including the expansion section to make continuity with the via land 2b. By expanding the bottom area of the via hole 11, connection reliability to the via land 2b is improved. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
