MICROCHIP AND METHOD FOR MANUFACTURING THE SAME

摘要

Provided are a microchip formed by joining a resinous film onto a resinous substrate, which enables the prevention of a leak due to peeling of a peripheral portion and prevention of deformation and clogging of a microchannel, and a method for manufacturing the same. The microchip comprises a resinous substrate including a first surface in which a channel groove is formed and a second surface on the side opposite to the first surface, and a resinous film joined to the first surface of the resinous substrate. A joint plane between the resinous substrate and the resinous film is composed of a central area including an area in which the channel groove is formed and a peripheral area corresponding to the outer periphery of the central area, the joint strength between the resinous substrate and the resinous film in the central area is larger than 0.098 N/cm, and the joint strength in at least part of the peripheral area of the joint plane is larger than the joint strength in the central area.