| 摘要 |
A heat dissipation circuit board and a manufacturing method thereof are provided to prevent malfunction due to conduction between a metal plate and a heating device mounting pad by forming an electrical signal short-circuiting unit in the metal plate. A heat dissipation circuit board includes a metal plate(10), an insulating layer(20), and a circuit pattern layer(30). A circuit pattern layer is formed on the insulating layer. The metal plate is made of one of Cu, Al, Ti, Ni, Fe, W, and Mg. The heating device mounting pad insertion unit and the heating device mounting pad pass through the insulating layer. The inner surface of the heating device mounting pad insertion unit is plated. The heating device mounting pad insertion unit is filled with the heating device mounting pad or metal material. An electric signal short-circuiting unit(40) is formed in the metal plate. The electric signal short-circuiting unit is empty or filled with the insulator or dielectric.
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