| 摘要 |
The present invention provides a laser drilling system (20) for drilling holes or cavities in a solid, in particular a solid dosage form. The system includes a loading zone (66), firing zone (30), inspection zone (29,31) and delivery zone (32). The system (20) also includes optional components such as a process validation system (22), solids detector, color detector, solids rejection/repositioning means, accepted products receptacle, rejected products receptacle and/or solids inspection system. Operation of the laser device in the firing zone (30) and of other optional equipment is synchronized with movement of a continuous solids indexer by way of an electronic synchronizer. A solids handling system includes an optional fill level detector that directly or indirectly controls solids loading means that fills a solids reservoir. The system can be run continuously, semicontinuously or batchwise. A solids rejection system in the system provides for reduced solids loss as compared to other laser drilling systems and solids recovery rates of 100% can be achieved. <IMAGE> |
