COPPER HYDRIDE NANOPARTICLE, PROCESS FOR PRODUCING THE SAME, METALLIC PASTE, AND ARTICLE

摘要

Provided are: copper hydride nanoparticles which have excellent oxidation resistance and can be easily sintered together with a metal filler; a process for producing the nanoparticles; a metallic paste capable of forming a metallic film having high conductivity; and an article having a high-conductivity metallic film. The copper hydride nanoparticles have an average particle diameter of 10-100 nm and the surface thereof has been coated with formic acid. The process comprises a step (a) in which a water-soluble copper compound is dissolved in water to prepare an aqueous solution containing copper ions, a step (b) in which formic acid is added to the aqueous solution to regulate the pH to 3 or lower, and a step (c) in which a reducing agent is added to the aqueous solution having a pH of 3 or lower while stirring the aqueous solution to thereby reduce the copper ions and generate copper hydride nanoparticles having an average particle diameter of 10-100 nm. The metallic paste comprises the copper hydride nanoparticle, a metal filler, and a resin binder. The article comprises a base and a metallic film formed thereon by applying the metallic paste and burning the coating.