发明名称 CONTROL METHOD OF SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To shorten a startup time, to reduce costs and to improve an operation rate of an inspection section, in an application development processing apparatus having the inspection section. SOLUTION: A control program for the application development processing apparatus 1 is set so that a processing flow F<SB>1</SB>, wherein a wafer W is conveyed from a cassette station 2 to a processing station 4 for processing at the processing station 4 and at an exposure apparatus and is then returned to the cassette station 2, and an inspection flow F<SB>2</SB>, wherein the wafer W is conveyed from the cassette station 2 to an inspection station 3 for inspection and is then returned to the cassette station 2, are implemented independently from each other. The inspection flow F<SB>2</SB>and the processing flow F<SB>1</SB>are implemented at startup and, at the same time, evaluation for an inspection unit of the inspection station 3 and adjustment for a processing unit of the processing station 4 can be performed. When the inspection station 3 is empty, the wafer W can be carried from the outside into the cassette station 2 and inspected. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009177193(A) 申请公布日期 2009.08.06
申请号 JP20090067273 申请日期 2009.03.19
申请人 TOKYO ELECTRON LTD 发明人 SHINOZUKA SHINICHI;WADA YOSHIMARE;YAMASHITA TAKEHIDE
分类号 H01L21/027;H01L21/677 主分类号 H01L21/027
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