| 摘要 |
PROBLEM TO BE SOLVED: To provide a dicing film which rarely produces cutting waste materials in the dicing step of a semiconductor wafer and is excellent in the adhesion between the surface layer of the film and an acrylic adhesive, and to provide a base substance film for the dicing film. SOLUTION: The base substance film for dicing includes an A layer, a B layer, and a C layer laminated in this order. The A layer includes 10 to 60 wt.% of hydrogen additive of vinyl aromatic hydrocarbon-conjugate diene hydrocarbon copolymer and 40 to 90 wt.% of ethylene (meta) acrylic acid copolymer; the B layer includes 30 to 90 wt.% of hydrogen additive of vinyl aromatic hydrocarbon-conjugate diene hydrocarbon copolymer and 10 to 70 wt.% of ethylene (meta) acrylic acid copolymer; the C layer is related to the base substance film for dicing including a thermoplastic resin having a rubber elasticity and the dicing film. COPYRIGHT: (C)2009,JPO&INPIT
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