发明名称 THERMAL MODULE
摘要 A thermal module includes a heat sink disposed on a contact surface of the heat source, a mounting bracket having first and second ends, a fastening member, a pressing member, and at least one clip. The mounting bracket surrounds the heat source. The first end has at least one latch portion. The second end has at least one mounting slot and at least one first opening in communication with the mounting slot. The fastening member is slidably mounted in the mounting slot. The clip spans the heat sink and has two ends respectively engaged with the latch portion and a portion of the fastening member respectively. The pressing member includes a pressing tightly engaged with the clip and urges the heat sink when an operation portion of the pressing member is rotated from the first predetermined position to the second predetermined position.
申请公布号 US2009190313(A1) 申请公布日期 2009.07.30
申请号 US20090358211 申请日期 2009.01.22
申请人 ASUSTEK COMPUTER INC. 发明人 LIN TZU-WEI;LIN JUI-YI;LU KUAN-YING;LI CHIEN-YI
分类号 H05K7/20 主分类号 H05K7/20
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