发明名称 LIGHT EMITTING DIODE PACKAGE
摘要 <p>A light emitting diode package for improving light reflection efficiency is provided to increase light efficiency and increase the light quantity by reducing the quantity of light increase. A light-emitting diode package comprises a housing(150), a lead frame, a light emitting diode chip and a sealing unit. The housing, the side wall forming the groove opened to one side is included. The lead frame is combined in the housing. As to the lead frame, single-side is exposed by groove. It the single-side of the lead frame has and the light emitting diode chip produces the light. The sealing unit is filled in groove in order to protect the light emitting diode chip. The side wall is formed so that one side for reflecting the light be inclined to the multiple.</p>
申请公布号 KR20090082050(A) 申请公布日期 2009.07.29
申请号 KR20080008304 申请日期 2008.01.25
申请人 ALTI-ELECTRONICS CO., LTD. 发明人 KIM, SUN HONG;KIM, MIN SIK;LEE, JI NA;LEE, JIN WON;PARK, KYOUNG IL
分类号 H01L33/60;H01L33/52;H01L33/62 主分类号 H01L33/60
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