发明名称 INJECTIN MOLDING SOLDER APPARATUS FOR PREVENTING CAVITY GENERATION DURING INJECTION OF MOLTEN SOLDER INTO SUBSTRATE AND METHOD THEREOF
摘要 A molten solder injection apparatus for preventing generation of cavities during a process for injecting solders into a substrate and an injecting method thereof are provided to perform stably and effectively a molten solder injection process by maintaining easily a state of low pressure or a state of vacuum of a receiving part of a substrate. A solder injection apparatus(100) injects solders into a substrate(10) having a receiving part for receiving molten solders. The solder injection apparatus includes a solder storage unit(111), a solder receiving chamber(I), and absorbing unit. The solder storage unit stores the molten solders. The solder receiving chamber is connected with the solder storage unit in order to receive the molten solders. The solder receiving chamber is in contact with the substrate in order to fill the molten solders in the receiving part through an outlet formed at a bottom surface. The absorbing unit maintain a low-pressure state of a front region of a front barrier rib in comparison with a pressure state of a peripheral region of the front barrier rib. The receiving part is filled with the molten solders according to a transferring operation of the solder receiving chamber in the low-pressure state.
申请公布号 KR20090078278(A) 申请公布日期 2009.07.17
申请号 KR20080004138 申请日期 2008.01.14
申请人 KOREA SEMICINDUCTOR SYSTEM CO., LTD. 发明人 LEE, SEUNG WOO
分类号 H01L23/488;H01L21/60 主分类号 H01L23/488
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