| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminated polyimide film which is easy of forming a thin functional film layer and a very thin polyimide insulating layer on a flexible printed circuit board etc. SOLUTION: A method for producing the laminated polyimide film comprises forming the thin functional film layer is on one surface of a polyimide film 0.5-10μm in thickness, laminating a reinforcing backing film having an adhesive layer on one surface of the laminated polyimide film formed by laminating a reinforcing film on the upper surface of the thin functional film layer and of a very thin polyimide film, and forming the thin functional film layer on the surface on the side opposite to the reinforcing backing film lamination surface of the polyimide film. Next, the reinforcing film having an adhesive layer is laminated on the surface of the thin functional film layer, and the reinforcing backing film having the adhesive layer is peeled off. COPYRIGHT: (C)2009,JPO&INPIT
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