发明名称 MULTISTAGE THICK FILM THERMOELECTRIC DEVICES
摘要 The present invention generally provides multistage thermoelectric coolers and methods for their fabrication. For example, in one aspect, a multistage thermoelectric cooler is disclosed that includes at least two cooling stages, each of which comprises a p-type leg portion and an n-type leg portion coupled to form a p-n junction. The p-n junctions of the two stages are thermally and electrically coupled such that at least a portion of a current flowing, during operation of the device, through one stage is coupled to the other. Further, at least one of the p- or n-type leg portions of one stage forms a unitary structure with a corresponding p- or n-type leg portion of the other stage.
申请公布号 WO2008094903(A3) 申请公布日期 2009.07.09
申请号 WO2008US52305 申请日期 2008.01.29
申请人 MASSACHUSETTS INSTITUTE OF TECHNOLOGY (MIT);CHEN, GANG;CHEN, XIAOYUAN;YANG, RONGGUI 发明人 CHEN, GANG;CHEN, XIAOYUAN;YANG, RONGGUI
分类号 H01L35/32 主分类号 H01L35/32
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