| 摘要 |
A semiconductor test coupon fixing grid and a manufacturing method thereof are provided to expand filed of view observed by using a TEM by fixing test coupons at an upper surface of a protruding. A test sample is prepared by cutting a semiconductor substrate including an analyzing area into a predetermined size. A test coupon of the semiconductor substrate is formed by polishing the test sample. A plurality of grooves(32) are formed at an upper surface of a grid(30) having a half circular shape. Thus, one or more protrusions(31) are formed so as to adhere the test coupon. The test coupon is adhere to the upper surface of the protrusions.
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