CIRCUIT CONNECTING MATERIAL AND STRUCTURE FOR CONNECTING CIRCUIT MEMBER

摘要

Provided is a circuit connecting material, which is arranged between circuit electrodes facing each other, pressurizes the facing circuit electrodes and electrically connects the electrodes in the pressurizing direction. The circuit connecting material has a constitution wherein an anisotropic conductive adhesive layer (A) having conductive particles (21) dispersed therein and an insulating adhesive layer (B) are laminated, and an adhesive force of the insulating adhesive layer (B) to a glass substrate is larger than that of the anisotropic conductive adhesive layer (A) to the glass substrate.