| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an LED package of a lead frame type suitable for mass production. <P>SOLUTION: The LED package includes a lead frame 110 having a pair of first electrodes 112 and a pair of second electrodes 114, an LED chip 120 disposed on the lead frame, and an encapsulant 130 encapsulating a portion of the lead frame and the LED chip. The first electrodes and the second electrodes are electrically connected with the LED chip. The first electrodes and the second electrodes are disposed outside the encapsulant. The encapsulant includes a top surface 130a, a bottom surface 130b, a first side surface 130c and a second side surface 130d facing the first side surface, wherein the first electrodes extend from the first side surface to the bottom surface, and the second electrodes extend from the second side surface to the bottom surface. <P>COPYRIGHT: (C)2009,JPO&INPIT |
