| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and substrate processing method, capable of excellently removing contamination from the periphery of a substrate without causing adverse effect due to a processing liquid on a device formation region of the front surface of the substrate. SOLUTION: A suction nozzle 70 for sucking a processing liquid is provided with respect to a brush 11. The distal end of the suction nozzle 70 has a distal end surface 72 facing a boundary portion 34 between a first contact surface 32 and a second contact surface 33, and an abutting surface 73 abutting on the first contact surface 32 and the second contact surface 33. A suction port 74 is formed on the distal end surface 72. A suction tube 76 connected to the suction nozzle 70 extends to the outside of a processing chamber 2, and its distal end is connected to a vacuum generator 60. When the vacuum generator 60 is driven, the processing liquid contained in the inside of a brush 11 is sucked by the suction port 74 and the flow of the liquid toward the suction port 74 is formed in the inside of the brush 11. COPYRIGHT: (C)2009,JPO&INPIT
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