| 摘要 |
PROBLEM TO BE SOLVED: To provide a reflow apparatus and method that performs a process for reflowing solder balls effectively. SOLUTION: A reflow apparatus 1 has a loader unit 20, a heating unit 30, an unloader unit 40, and a moving unit. The loader unit has an input module 220 and an input stacker 240. An object is housed in a magazine 100 to be laminated vertically, and a plurality of magazines are stored in the input stacker. The magazines stored in the input stacker are transported to the input module and made to flow into the heating unit by a transfer unit. Solder balls provided to the object in the heating unit are reflowed quickly by an induction heating system. Upon finishing the reflow process, the object is housed in a magazine placed in the output module 420 of the unloader unit and then stored in an output stacker 440. COPYRIGHT: (C)2009,JPO&INPIT |
