发明名称 SUBSTRATE INSPECTION METHOD AND SUBSTRATE INSPECTION APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To solve a problem associated with tact loss occurrence caused by the fact that the CPU processing speed for image data processing of image data obtained by image pickup can no longer catch up with the occurrence amount of the image data, when the packaging state of components is inspected after the picture of the substrate is taken by a camera, with the miniaturization and integration of components to be mounted. <P>SOLUTION: An inspection apparatus 100 includes a plurality of inspection heads (head 1, head 2) and takes a picture of substrates and inspect them using the plurality of heads (head 1, head 2) alternatively. Each inspection head (head 1, head 2) has a camera 104 to take a picture of substrates. Each inspection head (head 1, head 2) takes a picture of substrates using the camera 104 alternatively. Imaging treatment by one head and the image processing of images pictured by the other head are performed in parallel. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009130134(A) 申请公布日期 2009.06.11
申请号 JP20070303569 申请日期 2007.11.22
申请人 PANASONIC CORP 发明人 MAENISHI YASUHIRO;SHIMOGAMA YUSUKE
分类号 H05K13/08;H05K3/34 主分类号 H05K13/08
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