| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring substrate wherein a reinforcement layer is provided by removing a part of a support after laminating wiring layers and insulating layers on the support to improve its mechanical strength while lightening its weight, and its manufacturing method. SOLUTION: In this wiring substrate having a wiring member 30 in which the insulating layers including the wiring layers are laminated and the reinforcement layer 50 provided in the peripheral part of connection pads 18 on the wiring member 30, a plurality of recessed and projecting stripes 50a are provided in the reinforcement layer 50. COPYRIGHT: (C)2009,JPO&INPIT
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