A method for depositing an encapsulation layer onto a surface of polymeric fibers and ballistic resistant fibrics. More particularly, the atomic layer deposition of materials onto non-semiconductive polymeric fibers and fabrics, and to fabrics having an conformal encapsulation layer that has been applied by atomic layer deposition.
申请公布号
WO2008140578(A3)
申请公布日期
2009.06.04
申请号
WO2007US85065
申请日期
2007.11.19
申请人
HONEYWELL INTERNATIONAL INC.;PALLEY, IGOR;LI, CHIEN-WEI;BHATNAGAR, ASHOK;HURST, DAVID, A.;LAO, JINGYU