发明名称 Halbleiter-Fabrikautomatisierungssystem und Verfahren zur Bearbeitung eines Postens von Halbleiterwafern in einer vollautomatischen oder halbautomatischen Betriebsart
摘要 <p>A method for processing a lot of semiconductor wafers in a semiconductor factory automation (FA) system, wherein the lot is defined as a predetermined number of semiconductor wafers, includes the steps of: a) determining whether a first process equipment operable at a first operating mode has a job file corresponding to the lot of semiconductor wafers, wherein the job file represents data required for a semiconductor process; b) if the first process equipment operable at the first operating mode has the job file, processing the lot of semiconductor wafers according to the job file in the first process equipment; c) if the first process equipment operable at the first operating mode has not the job file, providing the job file to a second process equipment operable at a second operating mode; and d) processing the lot of semiconductor wafers according to the job file in the second process equipment. The method can effectively process a lot of semiconductor wafers at a full-automation mode or a semi-automation mode.</p>
申请公布号 DE10030481(B4) 申请公布日期 2009.06.04
申请号 DE2000130481 申请日期 2000.06.21
申请人 HYUNDAI ELECTRONICS INDUSTRIES CO. LTD. 发明人 JANG, BO-SOON
分类号 H01L21/67;H01L21/677;G05B15/02;G05B19/418;G06K19/00;H01L21/02 主分类号 H01L21/67
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