发明名称 Molded Sensor Package and Assembly Method
摘要 A method of forming a molded sensor includes providing a sensor assembly having a sensor, and a cap coupled to a portion of the sensor, the cap having an opening and forming an interior area. The method also includes blocking the opening in the cap, and molding a moldable material around a portion of the sensor assembly and a portion of a base such that the moldable material is coupled to the sensor assembly and the base, the interior area being substantially free of the moldable material.
申请公布号 US2009134481(A1) 申请公布日期 2009.05.28
申请号 US20070946539 申请日期 2007.11.28
申请人 ANALOG DEVICES, INC. 发明人 SENGUPTA DIPAK
分类号 H01L29/84;H01L21/56;H01L31/0203;H01L31/18 主分类号 H01L29/84
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