发明名称 METHOD FOR PACKAGING CIRCUIT COMPONENT
摘要 <p><P>PROBLEM TO BE SOLVED: To firmly perform fixing so as to prevent a pin from coming off, when packaging a circuit component to a printed wiring board by soldering. <P>SOLUTION: The pin 2 of a connector 1 is inserted to the through-hole 4 of the printed wiring board 3 and is soldered. A fixing member 10, which is to be deformed with heat, is attached to the outer circumference of the pin 2. The fixing member 10 is deformed from a straight state into a U shape by heating at soldering, due to the shape memory effect of the fixing member 10, and then, tightly holds the printed wiring board 3 in the peripheral edge of the through-hole 4. Solder is made to flow into a part between the pin 2 and the through-hole 4, thereby making the pin 2 solder to the printed wiring board 3. The fixing member 10 is engaged with the through-hole 4 so as to prevent the pin 2 from coming off. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009117643(A) 申请公布日期 2009.05.28
申请号 JP20070289630 申请日期 2007.11.07
申请人 SHARP CORP 发明人 WATASE SHIGERU
分类号 H05K3/34;H05K1/18 主分类号 H05K3/34
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